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產(chǎn)品技術(shù)資料 TECHNICAL INFORMATION KB KB-6160/6160A/6160C(ANSI:FR-4) 覆銅箔環(huán)氧玻纖布層壓板 Features 特點(diǎn) ● 兼容紫外光阻擋及光學(xué)自動檢查功能,可提高PCB 生產(chǎn)效率與準(zhǔn)確性 UVB and AOI (automatic optical inspection) compatible, so as to increase productivity and accuracy. ● 優(yōu)良的耐熱性能和機(jī)械性能 Excellent heat resistance and mechanical properties ● 符合IPC-4101C/21 的規(guī)范要求 IPC-4101C/21 specification is applicable. General Properties 一般特性 Test Item 測試項目 Unit 單位 Test Method (IPC-TM-650) 測試方法 Test Condition 處理條件 Specification (IPC-4101C) 規(guī)格值 Typical Value 典型值 Peel Strength (1 oz.) 2.4.8 125℃ ≥0.70 1.70 銅箔剝離強(qiáng)度 N/mm Float 288℃ / 10 Sec ≥1.05 1.75 Thermal Stress 熱應(yīng)力 Sec 2.4.13.1 Float288℃/unetched ≥10 180 Bow / Twist 彎弓度/翹曲度 % 2.4.22.1 A ≤ 1.0 0.17 / 0.35 Flexural Strength Warp ≥415 565 抗彎強(qiáng)度 N/mm2 2.4.4 Fill ≥345 416 Flammability 燃燒性 Rating UL94 UL94 UL94 V-0 V-0 Glass Transition (Tg) 玻璃化轉(zhuǎn)變溫度 ℃ 2.4.25 E-2/105 DSC ≥130 135 Surface Resistivity 表面電阻 M. 2.5.17.1 C-96/35/90 ≥1.0×104 1.0×106 Volume Resistivity 體積電阻 M.-cm 2.5.17.1 C-96/35/90 ≥1.0×106 1.0×108 Dielectric Constant 介電常數(shù) — 2.5.5.2 Etched/@1 MHZ ≤5.4 4.58 Loss Tangent 介質(zhì)損耗 — 2.5.5.2 Etched/@1 MHZ ≤0.035 0.022 Arc Resistance 耐電弧性 Sec 2.5.1 D-48/50+D-0.5/23 ≥60 125 Moisture Absorption % 2.6.2.1 ≤0.35(min0.51mm) 0.21 吸水率 D-24/23 ≤0.80(max0.51mm) 0.19 Z-Axis Expansion Z-軸熱膨脹系數(shù) ppm/℃ 2.4.24 E-2/105 TMA — 58/286 TD ℃ 2.4.24.6 TGA —— 305 T-260 min 2.4.24.1 TMA —— 10 Remarks: Typical values for reference only 注:典型值只作參考Specimen Thickness: 1.6 mm 1/1 樣品厚度:1.6 mm 1/1 A = Keep the specimen originally without any process 保持原樣,不作處理 C = Temperature and humidity conditioning 在恒溫恒濕的空氣中處理; D = Temperature conditioning immersion in distilled water. 浸在恒溫的水中處理 E = Immersing in distilled water with temperature control 在恒溫的空氣中處理;
Speciality Chart 板材特性圖 KB KB-6160/6160A/6160C(ANSI:FR-4) 覆銅箔環(huán)氧玻纖布層壓板 UV blocking (thickness) UV 阻擋 UV blocking (wave / UV-3100) Thermal expansion of Z-direction (test by TMA) Dielectric constant 介電常數(shù) Applications 應(yīng)用領(lǐng)域 ● Computer, communication equipment, instrument, OA equipment, etc. 計算機(jī)及外圍設(shè)備、通訊設(shè)備、儀器儀表、辦公自動設(shè)備等 采購信息Purchasing Information Base Color Thickness Copper Cladding Regular Size(mm) CTI Value 基板顏色厚度銅箔厚度常規(guī)尺寸CTI 值 黃色 (yellow) 0.05mm ~ 3.5mm 12μm , 18μm 35μm, 70μm 105μm 915*1220mm (36"*48") 1020*1220mm (40"*48") 1067*1220mm (42"*48") KB-6160:150V KB-6160A:175V KB-6160C: 300V/600V
上一篇:簡述PCB的飛針測試技術(shù)
下一篇:PCB工藝缺陷原因及排除方法---鉆孔篇
自定義數(shù)量數(shù)量需為50的倍數(shù),且大于10㎡
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產(chǎn)品技術(shù)資料
TECHNICAL INFORMATION
KB
KB-6160/6160A/6160C(ANSI:FR-4)
覆銅箔環(huán)氧玻纖布層壓板
Features 特點(diǎn)
● 兼容紫外光阻擋及光學(xué)自動檢查功能,可提高PCB 生產(chǎn)效率與準(zhǔn)確性
UVB and AOI (automatic optical inspection) compatible, so as to increase productivity and accuracy.
● 優(yōu)良的耐熱性能和機(jī)械性能
Excellent heat resistance and mechanical properties
● 符合IPC-4101C/21 的規(guī)范要求
IPC-4101C/21 specification is applicable.
General Properties 一般特性
Test Item
測試項目
Unit
單位
Test Method
(IPC-TM-650)
測試方法
Test Condition
處理條件
Specification
(IPC-4101C)
規(guī)格值
Typical
Value
典型值
Peel Strength (1 oz.)
2.4.8
125℃ ≥0.70 1.70
銅箔剝離強(qiáng)度
N/mm
Float 288℃ / 10 Sec ≥1.05 1.75
Thermal Stress
熱應(yīng)力
Sec 2.4.13.1 Float288℃/unetched ≥10 180
Bow / Twist
彎弓度/翹曲度
% 2.4.22.1 A ≤ 1.0 0.17 / 0.35
Flexural Strength Warp ≥415 565
抗彎強(qiáng)度
N/mm2 2.4.4
Fill ≥345 416
Flammability
燃燒性
Rating UL94 UL94 UL94 V-0 V-0
Glass Transition (Tg)
玻璃化轉(zhuǎn)變溫度
℃ 2.4.25 E-2/105 DSC ≥130 135
Surface Resistivity
表面電阻
M. 2.5.17.1 C-96/35/90 ≥1.0×104 1.0×106
Volume Resistivity
體積電阻
M.-cm 2.5.17.1 C-96/35/90 ≥1.0×106 1.0×108
Dielectric Constant
介電常數(shù)
— 2.5.5.2 Etched/@1 MHZ ≤5.4 4.58
Loss Tangent
介質(zhì)損耗
— 2.5.5.2 Etched/@1 MHZ ≤0.035 0.022
Arc Resistance
耐電弧性
Sec 2.5.1 D-48/50+D-0.5/23 ≥60 125
Moisture Absorption
% 2.6.2.1
≤0.35(min0.51mm) 0.21
吸水率
D-24/23
≤0.80(max0.51mm) 0.19
Z-Axis Expansion
Z-軸熱膨脹系數(shù)
ppm/℃ 2.4.24 E-2/105 TMA — 58/286
TD ℃ 2.4.24.6 TGA —— 305
T-260 min 2.4.24.1 TMA —— 10
Remarks: Typical values for reference only 注:典型值只作參考Specimen Thickness: 1.6 mm 1/1 樣品厚度:1.6 mm 1/1
A = Keep the specimen originally without any process 保持原樣,不作處理
C = Temperature and humidity conditioning 在恒溫恒濕的空氣中處理;
D = Temperature conditioning immersion in distilled water. 浸在恒溫的水中處理
E = Immersing in distilled water with temperature control 在恒溫的空氣中處理;
Speciality Chart 板材特性圖
KB
KB-6160/6160A/6160C(ANSI:FR-4)
覆銅箔環(huán)氧玻纖布層壓板
UV blocking (thickness) UV 阻擋 UV blocking (wave / UV-3100)
Thermal expansion of Z-direction (test by TMA) Dielectric constant 介電常數(shù)
Applications 應(yīng)用領(lǐng)域
● Computer, communication equipment, instrument, OA equipment, etc.
計算機(jī)及外圍設(shè)備、通訊設(shè)備、儀器儀表、辦公自動設(shè)備等
采購信息Purchasing Information
Base Color Thickness Copper Cladding Regular Size(mm) CTI Value
基板顏色厚度銅箔厚度常規(guī)尺寸CTI 值
黃色
(yellow)
0.05mm ~
3.5mm
12μm , 18μm
35μm, 70μm
105μm
915*1220mm (36"*48")
1020*1220mm (40"*48")
1067*1220mm (42"*48")
KB-6160:150V
KB-6160A:175V
KB-6160C: 300V/600V
上一篇:簡述PCB的飛針測試技術(shù)
下一篇:PCB工藝缺陷原因及排除方法---鉆孔篇